Display panel including external conductive pad, display apparatus including the same and method of manufacturing the same

ABSTRACT

A display apparatus includes a first base substrate defining: an outer edge thereof at which a side surface is exposed, and an upper surface thereof connected to the outer edge; first and second guiding dams on the upper surface and extending from an inside of the first base substrate to the outer edge; a first signal line on the upper surface and extending between the first and second guiding dams from the inside of the first base substrate to the outer edge thereof; and a first side pad connected to the first signal line. The first side pad includes a first horizontal portion on the upper surface and extending between the first and second guiding dams, in a top plan view, and the first horizontal portion extending to define a first vertical portion which is disposed on the side surface.

This patent application is a continuation application of U.S.application Ser. No. 16/106,826 filed Aug. 21, 2018, which is acontinuation application of U.S. application Ser. No. 15/403,346 filedJan. 11, 2017, which claims priority to Korean Patent Application No.10-2016-0071253, filed on Jun. 8, 2016, and all the benefits accruingtherefrom under 35 U.S.C. § 119, the content of which in its entirety isherein incorporated by reference.

BACKGROUND 1. Field

The present disclosure relates to a display apparatus and a method ofmanufacturing the same. More particularly, the present disclosurerelates to a display apparatus having a relatively thin bezel and amethod of manufacturing the display apparatus having the relatively thinbezel.

2. Description of the Related Art

Various display apparatuses providing multimedia content, such as atelevision set, a mobile phone, a navigation display, a computermonitor, a game unit, etc., have been developed.

Each display apparatus includes a display panel which generates anddisplays an image and a controller which generates various signals todrive the display panel. The controller is implemented such as by anelectronic circuit obtained by arranging electronic components on aprinted circuit board.

SUMMARY

One or more exemplary embodiment provides a display apparatus having arelatively thin bezel.

One or more exemplary embodiment provides a method of manufacturing thedisplay apparatus.

Exemplary embodiments of the invention provide a display apparatusincluding a first base substrate of a display panel of the displayapparatus which generates an image with a signal provided thereto, thefirst base substrate defining: an outer edge thereof at which asubstrate side surface of the first base substrate is exposed outsidethe display panel, and a substrate upper surface thereof connected tothe outer edge thereof; first and second guiding dams disposed on thesubstrate upper surface and extending from an inside of the first basesubstrate to the outer edge thereof; a first signal line to which thesignal is provided inside the display panel, the first signal linedisposed on the substrate upper surface and extending between the firstand second guiding dams in a direction from the inside of the first basesubstrate to the outer edge thereof; and a first side pad connected tothe first signal line and through which the signal passes from outsidethe display panel to the first signal line. The first side pad includesa first horizontal portion disposed on the substrate upper surface, thefirst horizontal portion extending between the first and second guidingdams in the direction from the inside of the first base substrate to theouter edge thereof, in a top plan view, and the first horizontal portionextending to define a first vertical portion of the first side pad whichis disposed on the substrate side surface exposed outside the displaypanel.

In the top plan view, the first signal line may include a distal enddisposed between the first and second guiding dams and overlapped withthe first horizontal portion.

The first and second guiding dams may be spaced apart from each other ina first direction, extend from the inside of the first base substrate tothe outer edge thereof in a second direction crossing the firstdirection, and further extend to define a connection insulating portionextending in a first direction to connect the first and second guidingdams to each other.

In the top plan view, the first and second guiding dams and theconnection insulating part may surround the first horizontal part andexpose the first vertical portion.

The display apparatus may further include a second base substrate of thedisplay panel which faces the first base substrate, and the firsthorizontal portion may be disposed between the first and second basesubstrates.

The first and second guiding dams may be arranged spaced apart from eachother in a first direction and extend from the inside of the first basesubstrate to the outer edge thereof in a second direction crossing thefirst direction. The first vertical portion disposed on the substrateside surface exposed outside the display panel may extend in a thirddirection substantially vertical to the first and second directions andface the second base substrate in the second direction.

The display apparatus may further include a printed circuit board whichprovides the signal and an anisotropic conductive film interposedbetween the first vertical portion and the printed circuit board toconnect the first vertical portion and the printed circuit board to eachother.

The anisotropic conductive film may be overlapped with the first basesubstrate in the second direction.

The anisotropic conductive film may be spaced apart from the second basesubstrate in the third direction.

The display apparatus may further include an upper conductive layerdisposed on a lower surface of the second base substrate and aninsulating layer disposed between the upper conductive layer and thefirst horizontal portion.

The display apparatus may further include a third guiding dam disposedon the substrate upper surface and extending the inside of the firstbase substrate to the outer edge thereof; a second signal line to whichthe signal is provided inside the display panel, the second signal linedisposed on the substrate upper surface and extending between the secondand third guiding dams in the direction from the inside of the firstbase substrate to the outer edge thereof; and a second side padconnected to the second signal line and through which the signal passesfrom outside the display panel to the second signal line. The secondside pad may include a second horizontal portion disposed on thesubstrate upper surface, the second horizontal portion extending betweenthe second and third guiding dams in the direction from the inside ofthe first base substrate to the outer edge thereof, in the top planview, and the second horizontal portion extending to define a secondvertical portion of the second side pad which is disposed on thesubstrate side surface exposed outside the display panel.

Exemplary embodiments of the invention provide a method of manufacturinga display apparatus, including: forming a conductive material layer on asubstrate upper surface of a first base substrate of a display panelwhich generates an image with a signal provided thereto, where the firstbase substrate defines an outer edge thereof at which a substrate sidesurface of the first base substrate is exposed outside the displaypanel, and a substrate upper surface thereof connected to the outer edgethereof; patterning the conductive material layer to form a first signalline to which the signal is provided inside the display panel; formingan insulating material layer on the first signal line on the substrateupper surface; patterning the insulating material layer to form firstand second guiding dams on the substrate upper surface, the first andsecond guiding dams each extending in a direction from an inside of thefirst base substrate to the outer edge of the first base substrate todefine a first conductive area therebetween which is open at the outeredge of the first base substrate; providing a conductive paste to thesubstrate side surface of the first base substrate which is exposedoutside the display panel; and moving a first portion of the conductivepaste on the substrate side surface into the first conductive areadefined between the first and second guiding dams, to form a firsthorizontal portion of a first side pad which is connected to the firstsignal line at the first conductive area and through which the signalpasses from outside the display panel to the first signal line.

The moving the first portion of the conductive paste may include usingan adhesive force between the conductive paste and the first and secondguiding dams.

The moving the first portion of the conductive paste may includedisposing the first base substrate such that the first and secondguiding dams are disposed to be parallel to a gravity direction, and themoving the first portion of the conductive paste may include using theadhesive force and the gravity.

An adhesive force within the material of the conductive paste may besmaller than the adhesive force between the conductive paste and thefirst and second guiding dams.

The providing the conductive paste may include: aligning a mask openingto be overlapped with the first conductive area, and coating theconductive paste on the mask. The first portion of the conductive pasteis moved into the first conductive area through the opening.

The method may further include forming a vertical portion of the firstside pad which extends from the horizontal portion thereof and isdisposed on the substrate side surface.

The moving the first portion of the coated conductive paste into thefirst conductive area through the opening of the mask may dispose asecond portion of the coated conductive paste different from the firstportion thereof, remaining in the opening. The forming the vertical partmay include curing the second portion of the conductive paste remainingin the opening.

The method may further include disposing an anisotropic conductive filmbetween the vertical portion and a flexible printed circuit boardthrough which the signal passes from outside the display panel to thefirst side pad, and thermocompression bonding the anisotropic conductivefilm to connect the vertical portion to the flexible printed circuitboard.

The patterning the conductive material layer may further form a secondsignal line to which the signal is provided inside the display panel.The patterning the insulating material may further form a third guidingdam on the substrate upper surface, the third guiding dam extending inthe direction from the inside of the first base substrate to the outeredge of the first base substrate to define a second conductive areabetween the second and third guiding dams which is open at the outeredge of the first base substrate. The method may further include movinga third portion of the conductive paste on the substrate side surface tothe second conductive area defined between the second and third guidingdams to form a second horizontal portion of a second side pad which isconnected to the second signal line at the second conductive area andthrough which the signal passes from outside the display panel to thesecond signal line.

The moving the first portion of the coated conductive paste into thefirst conductive area may dispose a second portion of the coatedconductive paste different from the first portion thereof, remaining onthe substrate side surface of the first base substrate. The method mayfurther include removing a portion of the second portion of theconductive paste remaining in the side surface area to form a verticalportion of the first side pad which extends from the first horizontalportion thereof and is disposed on the substrate side surface exposedoutside the display panel.

The method may further include providing a second base substrate of thedisplay panel to face the first base substrate, forming an upperconductive layer and an insulating layer on a lower surface of thesecond base substrate; and coupling the first and second base substratesto each other to dispose the upper conductive layer interposed betweenthe first and second base substrates and the insulating layer interposedbetween the upper conductive layer and the first horizontal portion.

According to the above, the signal line of the display panel isconnected to the flexible printed circuit board through the side padhaving the vertical part disposed on the side surface of the basesubstrate. Accordingly, the pad area required to dispose the side pad onthe display panel is reduced, and thus the bezel is reduced.

In addition, according to the manufacturing method of the displayapparatus, since the conductive paste moves to the connection areadefined between the guide dams, the horizontal part of the side pad maybe easily formed. Thus, the process time, the process cost, and theyield of the manufacturing method of the display apparatus may beimproved.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other advantages of the present disclosure will becomereadily apparent by reference to the following detailed description whenconsidered in conjunction with the accompanying drawings where:

FIG. 1 is a perspective view showing an exemplary embodiment of adisplay apparatus according to the invention;

FIG. 2 is an enlarged exploded perspective view showing an area at whicha display panel is connected to a flexible printed circuit board in thedisplay apparatus shown in FIG. 1;

FIG. 3A is a top plan view showing an exemplary embodiment of anassembled state of the display apparatus shown in FIG. 2;

FIGS. 3B and 3C are cross-sectional views respectively taken along linesI-I′ and II-II′ shown in FIG. 3A;

FIG. 4 is a cross-sectional view showing another exemplary embodiment ofa display apparatus according to the invention;

FIGS. 5A to 5H are perspective and top plan views explaining anexemplary embodiment of a method of manufacturing a display apparatusaccording to the invention;

FIGS. 6A to 6C are perspective views explaining another exemplaryembodiment of a method of manufacturing a display apparatus according tothe invention; and

FIG. 7 is a perspective view showing an exemplary embodiment of a tileddisplay apparatus including more than one of a display apparatusaccording to the invention.

DETAILED DESCRIPTION

The following description with reference to the accompanying drawings isprovided to assist in a comprehensive understanding of variousembodiments of the present disclosure as defined by the claims and theirequivalents. It includes various specific details to assist in thatunderstanding but these are to be regarded as merely exemplary.Accordingly, those of ordinary skill in the art will recognize thatvarious changes and modifications of the various embodiments describedherein can be made without departing from the scope and spirit of thepresent disclosure. In the drawings, the thickness of layers, films, andregions are exaggerated for clarity. Like numerals refer to likeelements throughout.

The use of the terms first, second, etc. do not denote any order orimportance, but rather the terms first, second, etc. are used todistinguish one element from another.

It is to be understood that the singular forms “a,” “an,” and “the”include plural referents unless the context clearly dictates otherwise.“At least one” is not to be construed as limiting “a” or “an.” “Or”means “and/or.” As used herein, the term “and/or” includes any and allcombinations of one or more of the associated listed items.

It will be further understood that the terms “includes” and/or“including”, when used in this specification, specify the presence ofstated features, integers, steps, operations, elements, and/orcomponents, but do not preclude the presence or addition of one or moreother features, integers, steps, operations, elements, components,and/or groups thereof.

It will be understood that when an element or layer is referred to asbeing “on,” “connected to” or “coupled to” another element or layer, itcan be directly on, connected or coupled to the other element or layeror intervening elements or layers may be present. In contrast, when anelement is referred to as being “directly on,” “directly connected to”or “directly coupled to” another element or layer, there are nointervening elements or layers present. It will be understood that whenan element is “connected” to another element, the elements may bephysically, electrically and/or fluidly connected to each other.

Furthermore, relative terms, such as “lower” or “bottom” and “upper” or“top,” may be used herein to describe one element's relationship toanother element as illustrated in the Figures. It will be understoodthat relative terms are intended to encompass different orientations ofthe device in addition to the orientation depicted in the Figures. Forexample, if the device in one of the figures is turned over, elementsdescribed as being on the “lower” side of other elements would then beoriented on “upper” sides of the other elements. The exemplary term“lower,” can therefore, encompasses both an orientation of “lower” and“upper,” depending on the particular orientation of the figure.Similarly, if the device in one of the figures is turned over, elementsdescribed as “below” or “beneath” other elements would then be oriented“above” the other elements. The exemplary terms “below” or “beneath”can, therefore, encompass both an orientation of above and below.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure belongs. It willbe further understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art and thepresent disclosure, and will not be interpreted in an idealized oroverly formal sense unless expressly so defined herein.

Exemplary embodiments are described herein with reference to crosssection illustrations that are schematic illustrations of idealizedembodiments. As such, variations from the shapes of the illustrations asa result, for example, of manufacturing techniques and/or tolerances,are to be expected. Thus, embodiments described herein should not beconstrued as limited to the particular shapes of regions as illustratedherein but are to include deviations in shapes that result, for example,from manufacturing. For example, a region illustrated or described asflat may, typically, have rough and/or nonlinear features. Moreover,sharp angles that are illustrated may be rounded. Thus, the regionsillustrated in the figures are schematic in nature and their shapes arenot intended to illustrate the precise shape of a region and are notintended to limit the scope of the present claims.

Hereinafter, the exemplary embodiments of the invention will beexplained in detail with reference to the accompanying drawings.

A display panel of a display apparatus includes a pixel at which animage is displayed and a signal line which is connected to the pixel.The signal line applies a driving signal to the pixel to drive thepixel. An end, such as a distal end, of the signal line is connected toa flexible printed circuit board. The flexible printed circuit board isconnected between the display panel and a printed circuit board asincluding or being a controller of the display apparatus. The signalline of the display panel receives the driving signal from the printedcircuit board through the flexible printed circuit board.

FIG. 1 is a perspective view showing an exemplary embodiment of adisplay apparatus 1000 according to the invention.

Referring to FIG. 1, the display apparatus 1000 includes a display panel100, a flexible printed circuit board 200 and a printed circuit board300. The flexible printed circuit board 200 and/or the printed circuitboard 300 may be provided in in plural within the display apparatus1000.

The display panel 100 generates and image and displays the image througha display area DA thereof. Components of the display panel 100 withinthe display area DA are operated by a control signal and image datagenerated by the printed circuit board 300, to generate and display theimage.

The display panel 100 includes a gate line provided in plural includinggate lines GL1 to GLn, a data line provided in plural including datalines DL1, DL2 and DL3 (up to DLm, not shown), and a sub-pixel SPXprovided in plural, which are arranged in the display area DA. The gatelines GL1 to GLn define lengths thereof which extend in a firstdirection DR1 and the gate lines GL1 to GLn are arranged in a seconddirection DR2 crossing the first direction DR1. The data lines DL1 toDLm are insulated from the gate lines GL1 to GLn while crossing the gatelines GL1 to GLn. The data lines DL1 to DLm define lengths thereof whichextend in the second direction DR2 and the data lines DL1 to DLm arearranged in the first direction DR1. When viewed in a top plan view, thedisplay panel 100 includes a non-display area NDA defined to surroundthe display area DA. The sub-pixels SPX are not arranged in thenon-display area NDA, and the image is not displayed through thenon-display area NDA. The non-display area NDA may correspond to a bezelof the display apparatus 1000. A dimension of the bezel of the displayapparatus 1000 in the top plan view, may be defined by dimensions of thenon-display area NDA taken in a plane defined by the first and seconddirections DR1 and DR2.

Each of the sub-pixels SPX is connected to a corresponding gate lineamong the gate lines GL1 to GLn and a corresponding data line among thedata lines DL1 to DLm.

The sub-pixels SPX are arranged in a matrix form along the first andsecond directions DR1 and DR2, within the display area DA. Eachsub-pixel SPX displays any one of primary colors, e.g., red, green andblue, but the colors displayed by the sub-pixels SPX should not belimited thereto or thereby. That is, the sub-pixels SPX may displaysecondary primary colors, e.g., yellow, cyan, magenta, etc., in additionto the red, green and blue primary colors.

A group of the sub-pixels SPX collectively form a pixel PX. Referring toFIG. 1, as an example, three sub-pixels SPX form one pixel PX, but theinvention should not be limited thereto or thereby. That is, two or fouror more sub-pixels SPX may form one pixel PX.

The pixel PX corresponds to an element of the display panel 1000 whichuses light to generate and display a unit image within the overall imagedisplayed by the display panel 100. A resolution of the display panel100 is determined by the number of the pixels PX arranged in the displaypanel 100. FIG. 1 shows only one pixel PX, and the other pixels areomitted for convenience of description.

In exemplary embodiments, the display panel 100 may be, but not limitedto, an organic light emitting display panel, and the sub-pixels SPX mayinclude an organic light emitting element which generates light withinthe display panel 100. As another example, the display panel 100 may bea liquid crystal display panel, the sub-pixels SPX may include a liquidcrystal layer which transmits or blocks light therethrough, and thedisplay apparatus 1000 may include a backlight unit disposed at a rearside of the display panel 100 to generate light outside the displaypanel 100.

The display panel 100 may have a plate-like shape defined by a pair oflong sides and a pair of short sides, which are respectively parallel tothe first and second directions DR1 and DR2. The display panel 100 maybe disposed in the plane defined by the first and second directions DR1and DR2, such as to be flat in such plane, but the invention is notlimited thereto. In exemplary embodiments, the display panel 100 mayhave various shapes such as having a shape curved along at least onedirection in a cross-sectional view thereof or have at least one roundededge when viewed in the top plan view.

The display panel 100 includes a first base substrate 110 and a secondbase substrate 130. The second base substrate 130 faces the first basesubstrate 110 and is disposed on the first base substrate 110. Theliquid crystal layer or the organic light emitting element may bedisposed between the first and second base substrates 110 and 130. Thefirst and second base substrates 110 and 130 may each define an uppersurface thereof, a lower surface thereof opposite to the upper surface,and side surfaces which connect the upper and lower surfaces to eachother. Respective layers disposed on the first and second basesubstrates 110 and 130 may be included in a collective first displaysubstrate and a collective second display substrate, respectively.

The flexible printed circuit board 200 connects the display panel 100and the printed circuit board 300 to each other. In an exemplaryembodiment, the flexible printed circuit board 200 faces the sidesurface of the display panel 100. In more detail, the flexible printedcircuit board 200 faces side surfaces of the first and second basesubstrates 110 and 130.

The flexible printed circuit board 200 is overlapped with the first andsecond base substrates 110 and 130 in the second direction DR2 and notoverlapped with the first and second base substrates 110 and 130 in avertical direction. Where the first and second base substrates 110 and130 are each disposed in different planes from each other, the flexibleprinted circuit board 200 is overlapped with both of the differentplanes, such that the flexible printed circuit board 200 is consideredoverlapped with the first and second base substrates 110 and 130 in thesecond direction DR2. Other elements of the display apparatus 1000 mayoverlap each other in the second direction DR2, in a similar manner asdescribed above. The vertical direction may be a third direction DR3substantially perpendicular to the first and second directions DR1 andDR2. In other words, the flexible printed circuit board 200 may notinterposed between the first and second base substrates 110 and 130 andmay not overlap either of the first and second base substrates 110 and130 in the top plan view.

In exemplary embodiments, the flexible printed circuit board 200 isprovided in a plural number, and the flexible printed circuit boards 200are arranged along a side of the display panel 100, such as along onelong side among the long sides extended in the first direction DR1. Thenumber of the flexible printed circuit boards 200 should not be limitedto a specific value.

As an exemplary embodiment, the flexible printed circuit board 200 mayinclude a driving chip DC. The driving chip DC may be implemented by atape carrier package and may include a chip in which a data driver (notshown) is implemented. The driving chip DC may further include a chip inwhich a gate driver is implemented. In addition, the gate driver may bedisposed in the non-display area NDA of the display panel 100 instead ofin a driving chip DC.

The printed circuit board 300 includes a controller. The controllergenerates and/or receives input image signals and converts a data formatof the input image signals to a data format appropriate to an interfaceand a driving mode of the data driver, the gate driver and the displaypanel 100, to generate the image data. The controller outputs the imagedata and the control signal, such that the printed circuit board 300 mayoutput the image data and the control signal. The image data output bythe printed circuit board 300 includes information for the imagedisplayed in the display area DA of the display panel 100.

The data driver at the flexible printed circuit board 200 receives theimage data and the control signal from the printed circuit board 300.The data driver converts the image data to data voltages in response tothe control signal and applies the data voltages to the data lines DL1to DLm of the display panel 100. The data voltages may be analogvoltages corresponding to the image data.

Various electronic components may be mounted on the printed circuitboard 300 to implement the controller. In an exemplary embodiment, forinstance, the printed circuit board 300 may include passive components,e.g., a capacitor, a resistor, etc., active components, e.g., amicro-processor including an integrated circuit, a memory chip, etc.,and conductive lines connecting the passive components and the activecomponents to each other.

FIG. 2 is an enlarged exploded perspective view showing an area at whicha display panel is connected to a flexible printed circuit board in thedisplay apparatus shown in FIG. 1.

Referring to FIG. 2, the display apparatus 1000 includes a plurality ofguiding dams, a plurality of signal lines and a plurality of side pads.

For the convenience of explanation, FIG. 2 shows first, second and thirdguiding dams 411, 412 and 413 among the guiding dams, first and secondsignal lines 431 and 432 among the signal lines, and first and secondside pads 451 and 452 among the side pads.

In an exemplary embodiment, the first to third guiding dams 411 to 413are disposed on a substrate upper surface 111 of the first basesubstrate 110. The lengths of the first to third guiding dams 411 to 413extend to an inner side of the substrate upper surface 111 from an(outer) edge 111 a of the substrate upper surface 111. The first tothird guiding dams 411 to 413 define lengths thereof which extend in thesecond direction DR2 and the first to third guiding dams 411 to 413 arearranged in the first direction DR1 at regular intervals.

In exemplary embodiments, the display apparatus 1000 may further includea connection insulating part 420 disposed on the first base substrate110. The connection insulating part 420 may define a length thereofwhich extends in the first direction DR1. In an exemplary embodiment,the connection insulating part 420 may be connected to an inner end ofthe first to third guiding dams 411 to 413 which is distal relative tothe edge 111 a of the substrate upper surface 111. The connectioninsulating part 420 may be integrally disposed or formed with the firstto third guide dams 411 to 413. That is, the connection insulating part420 and the first to third guide dams 411 to 413 may be disposed as asingle, unitary member. Stated in another way, one among the connectioninsulating part 420 and the first to third guide dams 411 to 413 mayextend to define one or all of the remaining among the connectioninsulating part 420 and the first to third guide dams 411 to 413.

A first connection area CA1 is defined between the first and secondguiding dams 411 and 412, and a second connection area CA2 is definedbetween the second and third guiding dams 412 and 413. The first andsecond connection areas CA1 and CA2 may alternate with the first tothird guide dams 411 to 413 in the first direction DR1.

The first side pad 451 includes a first horizontal portion 451 a and afirst vertical portion 451 b.

The first horizontal portion 451 a is disposed between the first andsecond guiding dams 411 and 412, in a top plan view. In more detail, thefirst horizontal portion 451 a is disposed on the upper surface 111 tocorrespond to the first connection area CA1. The first horizontalportion 451 a defines a length thereof which extends in the seconddirection DR2. The first horizontal portion 451 a is disposed betweenthe first and second base substrates 110 and 130 in a cross-sectional(e.g., thickness) direction like the third direction DR3.

The first vertical portion 451 b extends from an outer end of the firsthorizontal part 451 a which is adjacent to the edge 111 a of thesubstrate upper surface 111 and is disposed on a substrate side surface112 of the first base substrate 110 connected to the edge 111 a of thesubstrate upper surface 111. In more detail, a lower end of the firstvertical portion 451 b extends in a fourth direction DR4 opposite to thethird direction DR3 and is overlapped with the first base substrate 110in the second direction DR2. In addition, an upper end of the firstvertical portion 451 b extends in the third direction DR3 and isoverlapped with the second base substrate 130 in the second directionDR2.

In an exemplary embodiment, the first vertical portion 451 b may beintegrally provided with the first horizontal portion 451 a and may notbe interposed between the first and second base substrates 110 and 130.That is, the first vertical portion 451 b and the first horizontalportion 451 a may be disposed as a single, unitary member. Stated inanother way, one among the first vertical portion 451 b and the firsthorizontal portion 451 a may extend to define the other one among thefirst vertical portion 451 b and the first horizontal portion 451 a.

The second side pad 452 includes a second horizontal portion 452 a and asecond vertical portion 452 b. The second side part 452 is disposedspaced apart from the first side pad 451 in the first direction DR1. Thesecond guiding dam 412 is interposed between the first and second sidepads 451 and 452.

The second horizontal portion 452 a has the same shape as that of thefirst horizontal portion 451 a, the second vertical portion 452 b hasthe same shape as the first vertical portion 451 b, and the connectionrelationship between the second horizontal portion 452 a and the secondvertical portion 452 b is substantially the same as that between thefirst horizontal portion 451 a and the first vertical portion 451 b.Thus, further details of the shape and connection relationship of thesecond horizontal portion 452 a and the second vertical portion 452 bwill be omitted.

The first and second side pads 451 and 452 have a conductivity andinclude a conductive material. In an exemplary embodiment, theconductive material may include Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr,Li, Ca, LiF/Ca, LiF/Al, Mo, Ti, a compound thereof, or a combinationthereof (e.g., a combination of Ag and Mg). In addition, the conductivematerial may include a conductive polymer, a transparent metal oxide, agraphene, metal nanowire or a combination thereof.

The first and second signal lines 431 and 432 may be the first andsecond data lines DL1 and DL2 (refer to FIG. 1). The first and secondsignal lines 431 and 432 define lengths thereof which extend in thesecond direction DR2 on the substrate upper surface 111. As anotherexample, the first and second signal lines 431 and 432 may be two gatelines among the gate lines GL1 to GLn (refer to FIG. 1).

The first signal line 431 is connected to the first side pad 451. In anexemplary embodiment, a distal first end 431 a of the first signal line431 extends in the length direction of the first signal line 431 to theedge 111 a and is disposed in the first connection area CA1. The distalfirst end 431 a is overlapped with the first horizontal portion 451 a inthe third direction DR3 and is connected to the first horizontal portion451 a.

In an exemplary embodiment, the first signal line 431 may be disposedbetween the first horizontal portion 451 a and the first base substrate110.

The second signal line 432 is disposed spaced apart from the firstsignal line 431 in the first direction DR1. The second guiding dam 412is interposed between the first and second signal lines 431 and 432.

The second signal line 432 is connected to the second side pad 452. Inan exemplary embodiment, a distal second end 432 a of the second signalline 432 extends in the length direction of the second signal line 432to the edge 111 a and is disposed in the second connection area CA2. Thedistal second end 432 a is overlapped with the second horizontal portion452 a in the third direction DR3 and connected to the second horizontalportion 452 a.

In an exemplary embodiment, the second signal line 432 may be disposedbetween the second horizontal portion 452 a and the first base substrate110.

FIG. 3A is a top plan view showing an exemplary embodiment of anassembled state of the display apparatus shown in FIG. 2, and FIGS. 3Band 3C are cross-sectional views respectively taken along lines I-I′ andII-II′ shown in FIG. 3A.

The first and second side pads 451 and 452 have the similar structureand function, and thus, hereinafter, only the first side pad 451 will bedescribed with reference to FIGS. 3A to 3C, and detailed descriptions ofthe second side pad 452 will be omitted.

The first horizontal part 451 a, the connection insulating portion 420and the first and second guiding dams 411 and 412 may each define anupper surface thereof, a lower surface thereof opposite to the uppersurface, and side surfaces which connect the upper and lower surfaces toeach other.

Referring to FIGS. 3A to 3C, among side surfaces of the first and secondguiding dams 411 and 412, side surfaces thereof facing the firsthorizontal portion 451 a may make contact with side surfaces of thefirst horizontal portion 451 a. In addition, among side surfaces of theconnection insulating part 420, side surfaces thereof facing the firsthorizontal portion 451 a may make contact with side surfaces of thefirst horizontal portion 451 a. When viewed in the top plan view, thefirst and second guiding dams 411 and 412 and the connection insulatingpart 420 surround a distal end of the first horizontal portion 451 a. Inthe illustrated exemplary embodiment, the first and second guiding dams411 and 412 and the connection insulating portion 420 exposes the firstvertical portion 451 b when viewed in the top plan view. In other words,the first and second guiding dams 411 and 412 and the connectioninsulating part 420 do not surround the first vertical portion 451 b.

The display apparatus 1000 may further include an upper conductive layer131 and an insulating layer 132 disposed on a lower surface of thesecond base substrate 130 which faces the first base substrate 110. Theupper conductive layer 131 may be, but not limited to, a commonelectrode disposed or formed on an entirety of the lower surface of thesecond base substrate 130. The upper conductive layer 131 may includeLi, Ca, LiF/Ca, LiF/Al, Al, Mg, BaF, Ba, Ag, a compound thereof, or acombination thereof (e.g., a combination of Ag and Mg), or a transparentmetal oxide, e.g., indium tin oxide (“ITO”), indium zinc oxide (“IZO”),zinc oxide (“ZnO”), indium tin zinc oxide (“ITZO”), etc.

At least a portion of the upper conductive layer 131 is disposed betweenthe insulating layer 132 and the second base substrate 130. At least theportion of the upper conductive layer 131 faces the first horizontalportion 451 a such that the insulating layer 132 is disposed between theupper conductive layer 131 and the first horizontal portion 451 a.

In an exemplary embodiment, the insulating layer 132 is disposed on theconnection insulating portion 420, the first to third guiding dams 411to 413, and the first and second horizontal portions 451 a and 452 a. Atleast a portion of the insulating layer 132 is disposed between thefirst horizontal portion 451 a and the upper conductive layer 131 toinsulate the first horizontal portion 451 a from the upper conductivelayer 131. The insulating layer 132 has a single-layer structure of anorganic layer or an inorganic layer or a multi-layer structure of theorganic layer and/or the inorganic layer.

A portion of a lower surface of the insulating layer 132 defines aboundary or edge of the first connection area CA1. An upper surface ofthe horizontal portion 451 a makes contact with the portion of the lowersurface of the insulating layer 132 which defines the boundary or edgeof the first connection area CA1. In an exemplary embodiment, the firsthorizontal portion 451 a has a first thickness th1 corresponding to atotal or maximum distance between a lower surface of the firsthorizontal portion 451 a and the lower surface of the insulating layer132.

As described above, the lower end of the first vertical portion 451 bextends in the fourth direction DR4 and is overlapped with the firstbase substrate 110 in the second direction DR2. In addition, the upperend of the first vertical portion 451 b extends in the third directionDR3 and is overlapped with the insulating layer 132 and the second basesubstrate 130 in the second direction DR2.

In an exemplary embodiment, the first vertical portion 451 b has asecond thickness th2. The second thickness th2 corresponds to a distancebetween the substrate side surface 112 and an outer side surface 451_OSof the first vertical portion 451 b.

In an exemplary embodiment, the flexible printed circuit board 200 isoverlapped with the first vertical part 451 b in the second directionDR2. In more detail, the outer side surface 451_OS of the first verticalportion 451 b faces a lower surface of a first end (in the thirddirection DR3 of FIG. 3C) of the flexible printed circuit board 200.

In an exemplary embodiment, the display apparatus 1000 further includesan anisotropic conductive film 210. The anisotropic conductive film 210is disposed between the outer side surface 451_OS of the first verticalportion 451 b and the lower surface of the one end of the flexibleprinted circuit board 200 to connect the first vertical portion 451 band the flexible printed circuit board 200 to each other. Accordingly,the first signal line 431 is connected to the flexible printed circuitboard 200 through the first side pad 451. The anisotropic conductivefilm 210 includes an adhesive resin and a conductive member therein suchas a plurality of conductive balls distributed in the adhesive resin.

In an exemplary embodiment, the flexible printed circuit board 200 maybe curved (not shown) from the substrate side surface 112 such that asecond end (in the fourth direction DR4 in FIG. 3C) opposite to thefirst end of the flexible printed circuit board 200 faces a rear surfaceof the first base substrate 110 (e.g., furthest surface of the firstbase substrate 110 in the fourth direction DR4 in FIG. 3C).

In an exemplary embodiment, the anisotropic conductive film 210 may bedisposed on the entire surface of the outer side surface 451_OS of thefirst vertical portion 451 b. Where the anisotropic conductive film 210is on the entire surface of the outer side surface 451_OS, theanisotropic conductive film 210 may be overlapped with the first basesubstrate 110, the first horizontal portion 451 a, the insulating layer132 and the second base substrate 130 in the second direction DR2.Accordingly, a contact area between the anisotropic conductive film 210and the first vertical portion 451 b increases, and thus a processmargin is obtained to connect the anisotropic conductive film 210 andthe flexible printed circuit board 200 to each other.

In an exemplary embodiment, the display apparatus 1000 may furtherinclude a sealing member 120. The sealing member 120 is disposed betweenthe first and second base substrates 110 and 130 and provided along anedge of the first and second base substrates 110 and 130. The sealingmember 120 couples the first and second base substrates 110 and 130 toeach other. In an exemplary embodiment, the sealing member 120 includesa material having an adhesive property. The sealing member 120 is spacedapart from the connection insulating part 420 and the insulating layer132 in the second direction DR2.

As described above, the flexible printed circuit board 200 disposedoutside of a planar area of the display panel 100 is connected to thefirst and second signal lines 431 and 432 disposed inside the planararea of the display panel 100 through the first and second side pads 451and 452, respectively. Since a portion of the first and second side pads451 and 452 and the flexible printed circuit board 200 are each outsidethe planar area of display panel 100 and facing the side surface (e.g.,112) of the display panel 100, these portions do not contribute to aplanar area (e.g., in a plane defined in the first and second directionsDR1 and DR2) of a pad area inside the planar area of the display panel100 at which the flexible printed circuit board 200 and the displaypanel 100 are connected to each other. Thus, the pad area required toconnect the flexible printed circuit board 200 and the first and secondsignal lines 431 and 432 of the display panel 100 to teach other may bereduced. As a result, the bezel of the display apparatus 1000 may becomerelatively thin. That is, a dimension of the bezel in the plane definedin the first and second directions DR1 and DR2 and inside the planararea of the display panel 100 may be reduced.

The first to third guiding dams 411 to 413 insulate the first and secondside pads 451 and 452 from each other, and thus an electrical shortbetween the first and second signal lines 431 and 432 may be reduced oreffectively prevented. In addition, since the first and second signallines 431 and 432 are respectively overlapped with the first and secondside pads 451 and 452 in the third direction DR3 and connected to thefirst and second side pads 451 and 452 over a relatively large area, thefirst and second signal lines 431 and 432 are effectively connected tothe first and second side pads 451 and 452, and a connection electricalimpedance between the first and second signal lines 431 and 432 and thefirst and second side pads 451 and 452 may be controlled and improved.

In addition, in a method of manufacturing a display apparatus, since thefirst and second side pads 451 and 452 are relatively easily formed byusing the first to third guiding dams 411 to 413 as described below, aprocess time, a process cost and a yield of the manufacturing method ofthe display apparatus 1000 may be improved.

FIG. 4 is a cross-sectional view showing another exemplary embodiment ofa display apparatus according to the invention.

The cross-sectional view shown in FIG. 4 corresponds to thecross-sectional view taken along the line II-II′ shown in FIG. 3A andhas a same directionality orientation as FIG. 3C. Referring to FIG. 4,for a first side pad (e.g., 451 in FIG. 2) a first horizontal portion451 c may not contact with the connection insulating part 420 and/or theinsulating layer 132. Where the first horizontal portion 451 c is spacedapart from the connection insulating part 420 and/or the insulatinglayer 132, the first horizontal portion 451 c has a third thickness th3smaller than the first thickness th1 and a thickness of the firstconnection area CA1 (refer to FIG. 3C) in the third direction DR3.

For the first side pad including the first horizontal portion 451 cdescribed above, a first vertical portion 451 d is disposed only on thesubstrate side surface 112 (e.g., in a plane of the first base substrate110) and not overlapped with the insulating layer 132 and the secondbase substrate 130 in the second direction DR2 (e.g., not in planes ofthe insulating layer 132 and the second base substrate 130).

In an exemplary embodiment, the anisotropic conductive film 210 may bedisposed on an entire outer side surface 451_OD of the first verticalportion 451 d of the first side pad. In this case, the anisotropicconductive film 210 is overlapped with the first base substrate 110 inthe second direction DR2 and not overlapped with the insulating layer132 and the second base substrate 130 in the second direction DR2.

In the illustrated exemplary embodiment, the first horizontal portion451 c of the first side pad may disposed on (e.g., above in the thirddirection DR3) the distal first end 431 a of the first signal line 431,but it should not be limited thereto or thereby. In an alternativeexemplary embodiment, the first horizontal portion 451 c may beinterposed between the distal first end 431 a of the first signal line321 and the first base substrate 110.

FIGS. 5A to 5H are perspective views explaining an exemplary embodimentof processes in a method of manufacturing a display apparatus accordingto the invention. The structure of FIGS. 5A to 5H is taken withreference to FIGS. 1 and 2 described above.

Referring to FIGS. 1, 2 and 5A, for forming a first display substrate,the first and second signal lines 431 and 432 are formed on thesubstrate upper surface 111 of the first base substrate 110. In anexemplary embodiment, the first and second signal lines 431 and 432 areformed by forming a conductive material layer on the entire surface ofthe first base substrate 110 and patterning the conductive materiallayer. The conductive material layer includes the above-mentionedconductive materials. In an exemplary embodiment, the conductive layeris patterned by a photolithography process.

In an exemplary embodiment, among layers of the first display substratedisposed on the first base substrate 110, the first and second signallines 431 and 432 are disposed in a same layer as a layer in which adrain electrode or a gate electrode of a driving transistor driving thesub-pixel SPX (refer to FIG. 1) is disposed. The first and second signallines 431 and 432 may be formed together with the drain electrode andthe gate electrode without a separate additional process during apatterning process performed to form the drain electrode and the gateelectrode.

As shown in FIG. 5B, the first to third guiding dams 411 to 413 and theconnection insulating part 420 are formed on the first base substrate110. The first to third guiding dams 411 to 413 and the connectioninsulating part 420 are formed by forming an insulating material layeron the entire surface of the first base substrate 110 having the firstand second signal lines 431 and 432 thereon, and patterning theinsulating material layer. The insulating material layer includes any ofa number of insulating materials suitable for the purpose describedherein. In an exemplary embodiment, the insulating material layer ispatterned by a photolithography process.

In an exemplary embodiment, among layers of the first display substratedisposed on the first base substrate 110, the first to third guidingdams 411 to 413 may be disposed in the same layer as a layer in which agate insulating layer of the driving transistor driving the sub-pixelSPX is disposed (refer to FIG. 1 or an intermediate insulating layerinterposed between the driving transistor and a pixel electrode of thesub-pixel SPX). In an exemplary embodiment, the first to third guidingdams 411 and 413 may be formed together with the gate insulating layeror the intermediate insulating layer without a separate additionalprocess during a patterning process performed to form the gateinsulating layer or the intermediate insulating layer.

Referring to FIG. 5C, the second base substrate 130 such as havinglayers (e.g., 131, 132, etc.) of a second display substrate thereon, iscoupled to the first base substrate 110 having the layers of the firstdisplay substrate thereon. Side surfaces of the first and second basesubstrates 110 and 130 at outer edges thereof, area exposed outside thefirst and second base substrates 110 and 130. With the second basesubstrate 130 coupled to the first base substrate 110 and outer sidesurfaces thereof exposed, a mask MK is aligned with the exposed sidesurfaces of the first and second base substrates 110 and 130, such asbeing disposed overlapping planes of the first and second basesubstrates 110 and 130.

Although not shown in figures, the upper conductive layer 131 and theinsulating layer 132 are formed on a lower surface of the second basesubstrate 130 as layers of the collective second display substrate.

The mask MK includes an opening OP provided in plural (otherwisereferred to as “a plurality of openings OP”) defined therethrough andarranged in the first direction DR1. In an exemplary embodiment, themask MK is aligned such that the openings OP of the mask MK respectivelycorrespond to the first and second connection areas CA1 and CA2. Wherethe mask MK is aligned as described above, the openings OP areoverlapped with the first and second connection areas CA1 and CA2 in thesecond direction DR2. That is, the openings OP are disposed in a sameplane as the first and second connection areas CA1 and CA2 (e.g., theplane of 420, 411, 412 and 413).

In an exemplary embodiment, an inner side surface of the mask MK maymake contact with the first and second base substrates 110 and 130. Thatis, the innermost side surface of the mask MK in the second directionDR2 may make contact with the exposed outer side surfaces of the firstand second base substrates 110 and 130. With the mask MK in contact withthe first and second base substrates 110 and 130, a space may be formedaround the first and second signal lines 431 and 432 at the first andsecond connection areas CA1 and CA2. The space may be defined by sidesurfaces of the connection insulating portion 420 and the first to thirdguiding dams 411 to 413, a lower surface of the insulating layer 132 andan upper surface of the first base substrate 110, but the invention isnot limited thereto.

A conductive paste CP is provided onto an entire surface of an outerside surface MS of the mask MK which is opposite to the inner sidesurface thereof. The conductive paste CP includes a conductive materialand has fluidity and viscosity. The conductive paste CP is uniformlycoated on the outer side surface MS of the mask MK.

Referring to FIG. 5D, with the mask MK in contact with the first andsecond base substrates 110 and 130, the conductive paste CP providedonto the entire surface of the outer side surface MS of the mask MK isinserted into the first and second connection areas CA1 and CA2 throughthe openings OP of the mask MK. In an exemplary embodiment, theconductive paste CP may be moved from the outer side surface MS into theopenings OP by a squeezer SQ to allow the conductive paste CP to beeffectively inserted into the first and second connection areas CA1 andCA2 from the outer side surface MS. The squeezer SQ may move along thefirst direction DR1 and/or a direction opposite thereto, while movingthe conductive paste CP along the outer side surface MS.

Referring to FIG. 5E, the conductive paste CP inserted into the firstand second connection areas CA1 and CA2 from outside the first andsecond base substrates 110 and 130 moves along the space defined at thefirst and second connection areas CA1 and CA2. In an exemplaryembodiment, the conductive paste CP moves along the second direction DR2(indicated by open arrows in FIG. 5E). Accordingly, the conductive pasteCP makes contact with and is connected to the distal first and secondends 431 a and 431 b of the first and second signal lines 431 and 432.The moving conductive paste CP is guided by sidewalls of the first tothird guiding dams 411 to 413. A side surface of the connectioninsulating portion 420 at the innermost side of the first and secondconnection areas CA1 and CA2 restricts movement of the conductive pasteCP in the second direction DR2 to reduce or effectively prevent theconductive paste CP from entering the inside of the first base substrate110 past the connection insulating portion 420. In an exemplaryembodiment, with the movement of the conductive paste in the seconddirection DR2 within the space at the first and second connection areasCA1 and CA2, the space at the first and second connection areas CA1 andCA2 may be filled with the conductive paste CP, such as being completelyfilled with the conductive paste CP.

In the illustrated exemplary embodiment, the conductive paste CP movesby a capillary phenomenon. In more detail, an adhesive force isgenerated between the first to third guiding dams 411 to 413 and theconductive paste CP, and the conductive past CP moves within the spaceat the first and second connection areas CA1 and CA2 in the seconddirection DR2 by the adhesive force. To this end, the shape and materialof the first to third guiding dams 411 to 413 and the material of theconductive paste CP may be determined in various ways such the adhesiveforce therebetween becomes greater than a cohesiveness of the conductivepaste CP. That is, an adhesive force within the material of theconductive paste CP is smaller than the adhesive force between theconductive paste CP and the first to third guiding dams 411 to 413.

In an exemplary embodiment, gravity may be used to effectively move theconductive paste CP. In more detail, when the first and second basesubstrates 110 and 130 originally disposed in planes defined in thefirst and second directions DR1 and DR2, are disposed or rotated suchthat lengths (e.g., second direction DR2) of the first to third guidingdams 411 to 413 are substantially parallel to a gravity direction, theconductive paste CP flows from outside the first and second basesubstrates 110 and 130 and down along the lengths of the first to thirdguiding dams 411 to 413 (e.g., in the second direction DR2) due to thegravity.

Referring to FIGS. 5F and 5G among portions of the conductive paste CPtransferred into and through the openings OP, the conductive pasteportion CP1 filled in the first and second connection areas CA1 and CA2is cured, and thus the first and second horizontal portions 451 a and452 a (refer to FIG. 2) are formed. The conductive paste portion CP1terminates at the outer edge of the first and second base substrates 110and 130. The curing of the conductive paste portion CP1 may be processedwith the mask MK still in contact with the outer side surfaces of thefirst and second base substrates 110 and 130.

In addition, since the mask MK is disposed outside the first and secondbase substrates 110 and 130, a portion of the conductive past CPtransferred into the openings OP may remain outside of the first andsecond base substrates 110 and 130. Among portions of the conductivepaste CP transferred into and through the openings OP, the conductivepaste portion CP2 remaining in the openings OP of the mask MK while themask MK is in contact with the outer side surfaces of the first andsecond base substrates 110 and 130 is cured to form the first and secondvertical portions 451 b and 452 b (refer to FIG. 2) disposed outside thefirst and second base substrates 110 and 130. Where the conductive pasteportion CP2 is cured while remaining in the openings OP, an overallshape of the first and second vertical portions 451 b and 452 b may bedetermined depending on the overall shape of the openings OP disposedoutside the first and second base substrates 110 and 130. The thicknessof the first and second vertical portion 451 b and 452 b taken in thesecond direction DR2 may be determined depending on an amount of theconductive paste CP2 remaining outside the first and second basesubstrates 110 and 130 and in the openings OP in the second directionDR2.

Since the first and second horizontal portions 451 a and 452 a and thefirst and second vertical portion 451 b and 452 b are all formed from asame conductive paste material layer, the first and second side pads 451and 452 (refer to FIG. 2) may be a single, unitary (e.g., integral)member. An entire of the first and second vertical portion 451 b and 452b may be disposed outside the first and second base substrates 110 and130, such that outer surfaces of the first and second vertical portion451 b and 452 b (refer to 451_OS in FIG. 3C) are exposed outside thefirst and second base substrates 110 and 130.

Referring to FIG. 5H, the anisotropic conductive film 210 is interposedbetween the exposed outer surfaces of the first and second verticalportions 451 b and 452 b and an inner surface of the flexible printedcircuit board 200. The first and second side pads 451 and 452 areconnected to the flexible printed circuit board 200 with the anisotropicconductive film 210 interposed therebetween. In an exemplary embodiment,a pressure and heat may be applied in the second direction DR2 to theanisotropic conductive film 210 interposed between the first and secondvertical portions 451 b and 452 b and the flexible printed circuit board200 to thermocompress bond the anisotropic conductive film 210, therebyconnecting the first and second side pads 451 and 452 to the flexibleprinted circuit board 200. In an exemplary embodiment, the anisotropicconductive film 210 connects the first and second side pads 451 and 452to pads (not shown) of the flexible printed circuit board 200, which areinsulated from each other.

As described above, the first and second horizontal portions 451 a and452 a may be effectively formed by using the first to third guiding dams411 to 413 previously disposed on the first base substrate 110. As such,the process time, the process cost, and the yield of the manufacturingmethod of the display apparatus 1000 may be improved.

FIGS. 6A to 6C are perspective views explaining processes in anotherexemplary embodiment of a method of manufacturing a display apparatusaccording to the invention.

The exemplary embodiment of a method of manufacturing a displayapparatus illustrated in FIGS. 6A to 6C may include those processesillustrated in FIGS. 5A through 5C, except for aligning a mask (refer toMK in FIG. 5C) with the exposed side surfaces of the first and secondbase substrates 110 and 130.

In FIG. 6A, the second base substrate 130 such as having layers (e.g.,131, 132, etc.) of a second display substrate thereon, is coupled to thefirst base substrate 110 having the layers of the first displaysubstrate thereon. Side surfaces of at least the first and second basesubstrates 110 and 130 at outer edges thereof, are exposed outside thefirst and second base substrates 110 and 130.

Referring to FIG. 6A, with the second base substrate 130 coupled to thefirst base substrate 110 and outer side surfaces thereof exposed, theconductive paste CP may be coated on a side surface area AA defined onthe exposed substrate side surface 112 of the first base substrate 110.In an exemplary embodiment, the side surface area AA adjacent to thesubstrate side surface 112 is defined at the side surface of the displaypanel 100, and thus includes areas corresponding to exposed sidesurfaces of the first to third guiding dams 411 to 413, an exposed sidesurface of the insulating layer 132, and exposed side surfaces of thefirst and second base substrates 110 and 130.

As described above, with the conductive paste CP coated on the exposedside surfaces of the first to third guiding dams 411 to 413, theinsulating layer 132 and the first and second base substrates 110 and130 at side surface area AA, the conductive paste CP is moved from theouter side surfaces to inside the space formed around the first andsecond signal lines 431 and 432 at the first and second connection areasCA1 and CA2. In an exemplary embodiment, with the movement of theconductive paste CP in the second direction DR2 within the space at thefirst and second connection areas CA1 and CA2, the space at the firstand second connection areas CA1 and CA2 is filled with the conductivepaste CP, such as being completely filled with the conductive paste CP.

Referring to FIG. 6B, other than a portion of the conductive paste CPthat is transferred into the space at the first and second connectionareas CA1 and CA2, a portion of the conductive paste CP3 remains on thesubstrate side surface 112 at the side surface area AA to be disposedoutside the elements of the first and second display substrates. Aportion of the conductive paste CP3 remaining on the substrate sidesurface 112 at the side surface area AA may be removed. In more detail,a portion CP4 of the remaining conductive paste CP3, which is overlappedwith the first to third guiding dams 411 to 413 in the second directionDR2, is removed and the first to third guiding dams 411 are exposed tooutside the first and second display substrates. As a result, a portionCP5 of the conductive paste CP3, which is not removed, becomes the firstand second vertical portions 451 b and 452 b of first and second sidepads 451 and 452 (refer to FIG. 2). Accordingly, with the removal of theportion the first and second vertical portions 451 b and 452 b shown inFIG. 6C are formed.

Once the first and second vertical portions 451 b and 452 b of the firstand second side pads 451 and 452 are formed, referring to FIG. 5H andthe description thereof, an anisotropic conductive film 210 connects thefirst and second side pads 451 and 452 to the pads (not shown) of theflexible printed circuit board 200, which are insulated from each other.

As described above for the method processes of FIGS. 6A-6C, the firstand second horizontal portions 451 a and 452 a may be effectively formedby using the first to third guiding dams 411 to 413 previously disposedon the first base substrate 110. As such, the process time, the processcost, and the yield of the manufacturing method of the display apparatus1000 may be improved.

FIG. 7 is a perspective view showing an exemplary embodiment of a tileddisplay apparatus including more than one of a display apparatusaccording to the invention.

Referring to FIG. 7, a display apparatus 1000 is provided in plural andcoupled to each other to form the tiled display apparatus TD displayinga relatively large overall image. The display apparatuses 1000 arearranged in an M-by-N matrix (each of M and N is a natural number) andcoupled to each other. As described above, since the flexible printedcircuit board 200 (refer to FIG. 3C) is connected to the first andsecond signal lines 431 and 432 of a display panel 100 (refer to FIG.3C) through the first and second side pads 451 and 452 (refer to FIG.3C), the non-display area NDA, e.g., the bezel, of each of the displayapparatuses 1000 may become relatively small. Accordingly, a boundarybetween adjacent display apparatuses 1000 within the tiled display TD isnot perceived by a user of the tiled display TD, and thus the tileddisplay device TD displays a seamless relatively large image. As aresult, since the boundary between adjacent display apparatuses 1000within the tiled display TD is not perceived by a user, a displayquality of the tiled display device TD may be improved.

Although exemplary embodiments of the invention have been described, itis understood that the invention should not be limited to theseexemplary embodiments but various changes and modifications can be madeby one ordinary skilled in the art within the spirit and scope of theinvention as hereinafter claimed.

What is claimed is:
 1. A display apparatus comprising: a base substratecomprises a side surface and an upper surface which is extended from theside surface; a pixel on the base substrate; a signal line on the basesubstrate and electrically connected to the pixel, the signal linecomprising an upper surface furthest from the base substrate and an endsurface closest to the side surface of the base substrate; and a padfacing the side surface of the base substrate and connected to thesignal line, wherein a portion of the upper surface of the basesubstrate is between the end surface of the signal line and the sidesurface of the base substrate; the pad directly contacts the uppersurface of the signal line, and the pad extends from the upper surfaceof the signal line to directly contact both the portion of the uppersurface of the base substrate which is between the end surface of thesignal line and the side surface of the base substrate, and the sidesurface of the base substrate.
 2. The display apparatus of claim 1,wherein the pad comprises: a first portion which directly contacts theupper surface of the signal line and the portion of the upper surface ofthe base substrate which is between the end surface of the signal lineand the side surface of the base substrate; and a second portion whichdirectly contacts the side surface of the base substrate.
 3. The displayapparatus of claim 2, wherein the upper surface of the base substratefaces the first portion of the pad, and a portion of the signal line isbetween the first portion of the pad and the upper surface of the basesubstrate.
 4. The display apparatus of claim 1, further comprisinginsulating protruding portions on the base substrate, the insulatingprotruding portions spaced apart from each other with the signal linetherebetween.
 5. The display apparatus of claim 4, further comprising aninsulating connecting portion connected to the insulating protrudingportions and facing the pad.
 6. The display apparatus of claim 5,wherein a portion of the pad is surrounded by the insulating protrudingportions and the insulating connecting portion.
 7. The display apparatusof claim 5, wherein a portion of the pad directly contacts theinsulating protruding portions and the insulating connecting portion. 8.The display apparatus of claim 1, further comprising: a plurality ofpixels on the base substrate, and a plurality of signal lines on thebase substrate and respectively connected to the plurality of pixels ina one-to-one correspondence.
 9. The display apparatus of claim 1,further comprising a cover substrate facing the base substrate with thepixel, the signal line, and a portion of the pad between the coversubstrate and the base substrate.
 10. The display apparatus of claim 9,wherein a thickness of the portion of the pad is less than a distancebetween the base substrate and the cover substrate.
 11. The displayapparatus of claim 9, further comprising an insulating layer between theportion of the pad and the cover substrate.
 12. The display apparatus ofclaim 9, wherein the pad comprises: a first portion which directlycontacts the upper surface of the signal line and the portion of theupper surface of the base substrate which is between the end surface ofthe signal line and the side surface of the base substrate, and a secondportion which directly contacts the side surface of the base substrate,and the second portion is spaced apart from the cover substrate.
 13. Thedisplay apparatus of claim 9, wherein the cover substrate comprises aside surface corresponding to the side surface of the base substrate,and the pad comprises: a first portion which directly contacts the uppersurface of the signal line and the portion of the upper surface of thebase substrate which is between the end surface of the signal line andthe side surface of the base substrate, and a second portion whichdirectly contacts the side surface of the base substrate and directlycontacts the side surface of the cover substrate.
 14. The displayapparatus of claim 1, further comprising a flexible circuit board spacedapart from the side surface of the base substrate with the padtherebetween.
 15. A display apparatus comprising: a first substratecomprising a side surface and an upper surface which is extended fromthe side surface; a second substrate facing the first substrate; a pixelbetween the first substrate and the second substrate; a signal linebetween the first substrate and the second substrate and electricallyconnected to the pixel, the signal line comprising and an end surfaceclosest to the side surface of the first substrate; and a pad including:a first portion between the signal line and the second substrate, and asecond portion which directly contacts the side surface of the firstsubstrate, wherein a portion of the upper surface of the first substrateis between the end surface of the signal line and the side surface ofthe first substrate, and the first portion of the pad extends frombetween the signal line and the second substrate to directly contact theportion of the upper surface of the first substrate which is between theend surface of the signal line and the side surface of the firstsubstrate.
 16. The display apparatus of claim 15, further comprising aninsulating layer between the second substrate and the first portion ofthe pad.
 17. The display apparatus of claim 15, wherein the secondsubstrate comprises a side surface corresponding to the side surface ofthe first substrate, and the second portion of the pad directly contactsthe side surface of the second substrate.
 18. The display apparatus ofclaim 15, further comprising insulating protruding portions between thefirst substrate and the second substrate and spaced apart from eachother with the signal line interposed therebetween, wherein along thefirst substrate, the first portion of the pad is between the insulatingprotruding portions.
 19. The display apparatus of claim 18, furthercomprising an insulating connecting portion connected to the insulatingprotruding portions and overlapping the signal line.
 20. The displayapparatus of claim 19, wherein the first portion of the pad directlycontacts the insulating protruding portions and the insulatingconnecting portion.